PRODUCTION OF PHOTOSENSITIVE RESIN COMPOSITION AND RESIST IMAGE

PURPOSE:To obtain a compsn. having excellent sensitivity, resolution and heat resistance and fit for a positive type resist for producing a high integrated circuit. CONSTITUTION:When a photosensitive resin compsn. contg. alkali-soluble novolak resin and a quinonediazido compd. is produced, the novol...

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Bibliographic Details
Main Authors KASUYA KEI, ISOBE ASAO, KATO KOJI
Format Patent
LanguageEnglish
Published 07.05.1993
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To obtain a compsn. having excellent sensitivity, resolution and heat resistance and fit for a positive type resist for producing a high integrated circuit. CONSTITUTION:When a photosensitive resin compsn. contg. alkali-soluble novolak resin and a quinonediazido compd. is produced, the novolak resin is freed of a low mol.wt. component and a cyclic phenol compd. represented by the structural formula is further incorporated. A resist image is produced with the resulting photosensitive resin compsn. In the formula, X is H or hydroxyl, Y is H or hydroxyl, one of X and Y is hydroxyl and R is H, alkyl, alkoxy or phenyl.
Bibliography:Application Number: JP19910273945