ALN SUBSTRATE, HAVING VIAHOLE AND JOINED TO COPPER PLATE

• Main Authors: NAKANO TADASHI, KANAMARU TAKAO, UDAGAWA ETSURO, KUMAGAI MASATO, FUKUDA KENJI
• Format: Patent
• Language: English
• Published: 27.04.1993
• Subjects: ARTIFICIAL STONE; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CEMENTS; CERAMICS; CHEMISTRY; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; CONDUCTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; LIME, MAGNESIA; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; REFRACTORIES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SLAG; TREATMENT OF NATURAL STONE

PURPOSE:To ensure electric conduction of the front and back surfaces of a copper plate-joined substrate in which the front surface is a packaging side having a wiring pattern and the back surface is a heat radiating side, enable effective utilization of both the surfaces and simultaneously provide a joined substrate with a laminated structure. CONSTITUTION:A copper plate having both patterned surfaces is electrically joined to a copper plate-joined substrate in which copper plates 11 are joined to the front and back surfaces of a ceramic substrate 13 with a brazing fuller material 12 of an alloy containing a lubricant metal in viahol 14.