ALN SUBSTRATE, HAVING VIAHOLE AND JOINED TO COPPER PLATE

PURPOSE:To ensure electric conduction of the front and back surfaces of a copper plate-joined substrate in which the front surface is a packaging side having a wiring pattern and the back surface is a heat radiating side, enable effective utilization of both the surfaces and simultaneously provide a...

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Bibliographic Details
Main Authors NAKANO TADASHI, KANAMARU TAKAO, UDAGAWA ETSURO, KUMAGAI MASATO, FUKUDA KENJI
Format Patent
LanguageEnglish
Published 27.04.1993
Subjects
ARTIFICIAL STONE
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CEMENTS
CERAMICS
CHEMISTRY
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
CONDUCTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
LIME, MAGNESIA
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
REFRACTORIES
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SLAG
TREATMENT OF NATURAL STONE
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Summary:PURPOSE:To ensure electric conduction of the front and back surfaces of a copper plate-joined substrate in which the front surface is a packaging side having a wiring pattern and the back surface is a heat radiating side, enable effective utilization of both the surfaces and simultaneously provide a joined substrate with a laminated structure. CONSTITUTION:A copper plate having both patterned surfaces is electrically joined to a copper plate-joined substrate in which copper plates 11 are joined to the front and back surfaces of a ceramic substrate 13 with a brazing fuller material 12 of an alloy containing a lubricant metal in viahol 14.
Bibliography:Application Number: JP19910296665