TOOTH SETTING AND DRESSING METHOD IN SLICING DEVICE AND ITS DEVICE

PURPOSE:To detect cutting resistance at the time of cutting a wafer for automatically dressing an inner peripheral cutting edge to set the teeth of the blade. CONSTITUTION:In a slicing device which moves a workpiece 8 in the radial direction of a blade 3 to the inner peripheral cutting edge 5 of a b...

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Bibliographic Details
Main Authors OUCHI HISAO, KAWAGUCHI KEIJI, HAMAZAKI TATSUMI
Format Patent
LanguageEnglish
Published 27.04.1993
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Summary:PURPOSE:To detect cutting resistance at the time of cutting a wafer for automatically dressing an inner peripheral cutting edge to set the teeth of the blade. CONSTITUTION:In a slicing device which moves a workpiece 8 in the radial direction of a blade 3 to the inner peripheral cutting edge 5 of a blade 3 rotating at high speed to cut the workpiece 8 to fixed thickness for producing a wafer, cutting resistance at the time of cutting the workpiece is detected, and voltage is applied between an electrode 13 provided opposite to the cutting edge 5 and the blade 3 on the magnitude of the cutting resistance to execute the electrolytic dressing of the cutting edge 5 for keeping the cutting resistance constant. A device to execute this method is provided in a workpiece holding section 10, and has a cutting resistance detecting means 12 to detect the cutting resistance at the time of cutting the workpiece, the electrode 13 arranged opposite to the cutting edge 5, a power source device 14 to apply the D.C. voltage for the electrolytic dressing of the cutting edge between the electrode 13 and the blade 3, and a control means 15 for turning on and off the power source device 14 on the magnitude of the cutting resistance detected by the cutting resistance detecting means 12.
Bibliography:Application Number: JP19910269277