PHOTOSENSITIVE COMPOSITION

PURPOSE:To provide the photosensitive compsn. which cures with a high sensitivity and can form a secure film by incorporating a cation polymerizable compd., polyvinylidene fluoride resin and arom. iodonium salt into the photosensitive compsn. which is cured by a cation polymn. reaction. CONSTITUTION...

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Bibliographic Details
Main Authors MIYAGAWA MASASHI, NODA MARIKO, OOHAYASHI HIROHARU, MINAMI TORU
Format Patent
LanguageEnglish
Published 27.02.1992
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Summary:PURPOSE:To provide the photosensitive compsn. which cures with a high sensitivity and can form a secure film by incorporating a cation polymerizable compd., polyvinylidene fluoride resin and arom. iodonium salt into the photosensitive compsn. which is cured by a cation polymn. reaction. CONSTITUTION:The cation polymerizable compd., the polyvinylidene fluoride resin and the arom. iodonium salt are incorporated into the photosensitive compsn. which is cured by the cation polymn. reaction. An epoxy compd. having >=2 oxysilane rings in one molecule or a vinyl ether compd. having >=2 vinyl ether groups in one molecule is used for the cation polymerizable compd. The arom. iodonium salt as a photopolymn. initiator releases Lewis acid by irradiation with UV rays to initiate the cation polymn. The polyvinylidene fluoride resin is incorporated at 1 to 100 parts per 100 parts cation polymerizable compd. into the compsn. The arom. iodonium salt is incorporated at 0.1 to 30 pts. per 100 pts. cation polymerizable compd. into the compsn.
Bibliography:Application Number: JP19900172722