METHOD OF SUPPRESSING ATTENUATION OF ULTRAVIOLET RAYS ILLUMINATION AND SEMICONDUCTOR PACKAGE SEALING DEVICE USING SAID METHOD

• Main Authors: SHIMOYAMA AKIO, KITAOKA KOKI, IWASAKI NORIKI
• Format: Patent
• Language: English
• Published: 19.02.1992
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PURPOSE:To achieve uniform illumination onto an entire surface most efficiently at the same time by passing all ultraviolet rays from an ultraviolet rays emitting equipment into a crystal glass and adjusting the crystal glass length to an optimum value. CONSTITUTION:An ultraviolet rays emitting equipment 5 is placed at a lower side of a base plate 8 of a semiconductor package sealing device 6. A package table 9 consisting of the crystal glass and this crystal glass are formed in a polished glass shape at the surrounding and this package table 9 is fixed through the base plate 8 while being adhered to the ultraviolet rays emitting equipment 5, thus enabling ultraviolet rays from the ultraviolet rays emitting equipment 5 to enter directly the package table 9 without going through an air layer.