TREATMENT OF COPPER OR COPPER ALLOY PLATE AND METAL BASE BOARD AND METAL BASE WIRING BOARD USING SAME METAL PLATE

• Main Author: TSUYAMA KOICHI
• Format: Patent
• Language: English
• Published: 12.02.1992
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

PURPOSE:To inexpensively and easily obtain a copper or copper alloy plate having excellent adhesion by roughening the surface of the copper or copper alloy plate by mechanical grinding so as to obtain specific depth and treating the ground surface with a silane coupling agent. CONSTITUTION:The surface of a copper or copper alloy plate is roughened by mechanical grinding so as to obtain depth of 3-10mum and the ground surface is treated with a silane coupling agent to make it possible to obtain the copper or copper alloy plate having excellent adhesiveness. A method using sand paper is suitably performed in the mechanical grinding roughening the surface of the copper or copper alloy plate. When the depth of surface roughening is below 3mum, adhesive strength is insufficient. When the depth exceeds 10mum, a time is required in surface roughening and a resin having good flowability must be used at the time of the formation of an insulating layer. A metal base board is prepared by using the copper or copper alloy plate thus treated and providing a conductor foil thereon through an org. resin or a composite material of the org. resin and inorg. matter becoming the insulating layer and the mechanical bonding of the insulating layer and the surface of a metal is obtained and adhesiveness is enhanced.