WIRE BONDING DEVICE

PURPOSE:To obtain a device for making a bonding state uniform to reduce a malfunction by providing vibration applying means for applying an ultrasonic twisting vibration to a capillary. CONSTITUTION:A wire bonding device for bonding a wire 3 to an electrode of a member to be bonded by using a capill...

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Bibliographic Details
Main Authors KASHIMA NORIYASU, IKETANI YUKIHIRO, SUEMATSU MUTSUMI
Format Patent
LanguageEnglish
Published 25.12.1992
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To obtain a device for making a bonding state uniform to reduce a malfunction by providing vibration applying means for applying an ultrasonic twisting vibration to a capillary. CONSTITUTION:A wire bonding device for bonding a wire 3 to an electrode of a member to be bonded by using a capillary 1 in which the wire 3 is inserted, comprises vibration applying means 10 for applying an ultrasonic twisting vibration to the capillary 1. For example, an ultrasonic horn 10 having first, second arms 10a, 10 provided with first, second ultrasonic vibrators 11, 12 at the other ends horizontally disposed in space in parallel and a coupler 10c for connecting one end to one end of the arms 10a, 10b to hold the capillary 1 at a center, is provided. The vibrators 11, 12 are alternately vibrated to be elongated and contracted thereby to apply an ultrasonic twisting vibration of a microscopic angle to the capillary 1.
Bibliography:Application Number: JP19910150194