MANUFACTURE OF BUMP

• Main Authors: YAMAKAWA KOJI, HISATSUNE YOSHIMI
• Format: Patent
• Language: English
• Published: 21.12.1992
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To obtain bumps having uniform height, by shorting electrodes of a semiconductor chip and making surface potentials uniform which potentials are influenced by a constitution circuit in the semiconductor chip with which the above electrodes are connected. CONSTITUTION:A semiconductor chip is...