MANUFACTURE OF BUMP

PURPOSE:To obtain bumps having uniform height, by shorting electrodes of a semiconductor chip and making surface potentials uniform which potentials are influenced by a constitution circuit in the semiconductor chip with which the above electrodes are connected. CONSTITUTION:A semiconductor chip is...

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Bibliographic Details
Main Authors YAMAKAWA KOJI, HISATSUNE YOSHIMI
Format Patent
LanguageEnglish
Published 21.12.1992
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To obtain bumps having uniform height, by shorting electrodes of a semiconductor chip and making surface potentials uniform which potentials are influenced by a constitution circuit in the semiconductor chip with which the above electrodes are connected. CONSTITUTION:A semiconductor chip is activated in palladium solution, and a layer containing palladium is selectively stuck on Al electrodes 2. A steel probe 6 having pins 5 capable of shorting electrodes of the semiconductor chip and a jig 7 are used, and the pins are brought into contact with the electrodes in regions where bumps are not formed. By performing electroless nickel plating using Ni-P solution, a plurality of bumps 8 composed of nickel films containing phosphorus are formed on the exposed Al electrodes 2. After that, shorted state is released by eliminating the steel probe. Thereby bumps having uniform height can be formed on the electrodes of a semiconductor chip.
Bibliography:Application Number: JP19910144420