METHOD OF EVALUATION BY FOREIGN MATERIAL INSPECTION DEVICE

• Main Authors: NOGUCHI MINORU, KENBO YUKIO
• Format: Patent
• Language: English
• Published: 18.12.1992
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MATERIALS THEREFOR; MEASURING; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PURPOSE:To evaluate micro foreign materials by using a microscope to detect and store the position of each standard particle on a base for evaluation, and evaporating a solvent so as to reduce the diameter of each particle to below specific size for the preparation of the base for evaluation, and finding the rate of the number of detected particles of below the specific size using the base. CONSTITUTION:Standard particles 1 of diameter not more than 0.05mum are put in an organic solvent 2 in a container 13 on an ultrasonic vibrator 3 and are swelled by vibration and the solvent 2 and the particles 1 are sprayed to a semiconductor wafer 5. A standard mark particle 6 is attached and fixed on the wafer 5 and held against a wafer chuck 7. An XY stage 8 is moved and the position 11a of each particle 1 is detected and stored by an optic microscope 9 using the position of the particle 6 as a reference and then the temperature of the chuck 7 is raised to evaporate the solvent 2 and to reduce the diameter of each particle to not more than 0.05mum and the chuck 7 is used as a base 5 for evaluation. The base 5 for evaluation is put on a foreign material inspection device 18 and the standard particles are detected by the foreign material inspection device 18 and the rate of the number of the particles detected at a position detected by an observing system 9 is found so as to perform evaluation for foreign materials of diameter not more than 0.05mum.