CATALYST LIQUID FOR COPPER BASE MATERIAL-SELECTING ELECTROLESS PLATING

• Main Authors: HAGA MASAKI, OKADA TAKASHI, UCHIDA HIROKO, UCHIDA MAMORU
• Format: Patent
• Language: English
• Published: 17.12.1992
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE:To selectively form a good plating film only on a copper conductive part by using a catalytic liquid comprising a combination of paradium compd. and specified chelating agent. CONSTITUTION:The catalytic liquid is prepared by mixing a paradium compd. dissolved in hydrochloric acid or sulfuric acid with aq. soln. of chelating agent. To control pH, acid such as hydrochloric acid or an alkali compd. such as NaOH is used. As necessary, a surfactant thiourea of pH buffer can be used individually or by mixing thereof. The treatment with this catalytic liquid is performed as usual, by dipping the material in the liquid at about 10-90 deg.C for 10sec. to 10min.