CATALYST LIQUID FOR COPPER BASE SELECTING ELECTROLESS PLATING

• Main Authors: HAGA MASAKI, OKADA TAKASHI, UCHIDA HIROKO, UCHIDA MAMORU
• Format: Patent
• Language: English
• Published: 17.12.1992
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE:To form a good plating film only on a conductive part by using an aq. soln. of paradium compd. containing no halogen as the catalytic liquid of electroless plating. CONSTITUTION:The add amt. of paradium compd. is specified to about 0.0001-0.5mol/l and no halogen is included in the liquid. The liquid has pH<=7. This catalyst liquid is used to selectively activate copper base material, with which electroless plating only on a copper base part can be performed even when a base body comprising an insulating material and conductive material in one body such as a print circuit board is used. Conditions of electroless plating are as usual.