PIT-FILLING COMPOSITION FOR PIPE

PURPOSE:To provide a pit-filling composition for a pipe which is excellent in flow and can extend a distance between adjacent unfilled pits by using a base comprising a reactive liquid resin, spherical inorganic particles and spherical synthetic resin particles and a curing agent. CONSTITUTION:A bas...

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Bibliographic Details
Main Authors MATSUMURA MASAHITO, ANAMIZU TAKASHI
Format Patent
LanguageEnglish
Published 06.02.1992
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Summary:PURPOSE:To provide a pit-filling composition for a pipe which is excellent in flow and can extend a distance between adjacent unfilled pits by using a base comprising a reactive liquid resin, spherical inorganic particles and spherical synthetic resin particles and a curing agent. CONSTITUTION:A base is produced by mixing 100 pts.wt. reactive liquid resin (e.g. epichlorohydrin/bisphenol A epoxy resin) with 5-30 pts.wt. spherical inorganic particles (e.g. spherical glass powder) and 3-30 pts.wt. spherical synthetic resin particles (e.g. spherical polyethylene particles). This base is combined with a curing agent (e.g. liquid polyamine curing agent) to produce a two-pack pit-filling composition for a pipe. The obtained composition 2 is put in a vessel 1 connected to a pipe 4 to be mended through a connecting pipe 7, and a blower 3 is operated to force the composition 2 into the pipe 4 to thereby fill corrosion pits 5, thus forming filled parts 6.
Bibliography:Application Number: JP19900141539