MANUFACTURING APPARATUS FOR MULTILAYER PRINTED BOARD

• Main Authors: MUROOKA HIDEYASU, KYOI MASAYUKI
• Format: Patent
• Language: English
• Published: 14.12.1992
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PURPOSE:To make thickness of a board after adhesion uniform and to easily form a multilayer printed board having no interlayer deviation and no interlayer bubble by reducing in thickness a hot plate and eliminating generation of warpage of a hot plate due to insertion of a jig plate in steps of heating and pressurizing. CONSTITUTION:An apparatus for manufacturing a multilayer printed board, has two jig plates 2, 3 for holding a plurality of printed board 1 laminated through adhesive, a hot plate 14 for heating and pressuring a jig plate 4, and a support structure for holding the plate 14. The thickness of the plate 14 formed of an upper hot plate 12 and a lower hot plate 13. In this case, if a ratio of thickness to width of the plate 14 is 1/50 or less, it is sufficiently thin. Thus, a temperature distribution of the hot plate when the plate 4 for holding a laminate is inserted between the plates 14 becomes ignorably small, and no warpage of the plate 14 occurs inward. Even if warpage tends to occur, the hot plate is thin and low rigid, and hence it does not affect influence to the thickness of the board.