ION ETCHING DEVICE
PURPOSE:To omni-circumferentially change an ion beam radiating direction without mechanical rotation of a sample in an ion etching device by which the ion beam can be radiated slantly to the sample. CONSTITUTION:An ion etching device is constructed in such a manner that vertically two-stage type def...
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Main Author | |
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Format | Patent |
Language | English |
Published |
27.11.1992
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE:To omni-circumferentially change an ion beam radiating direction without mechanical rotation of a sample in an ion etching device by which the ion beam can be radiated slantly to the sample. CONSTITUTION:An ion etching device is constructed in such a manner that vertically two-stage type deflecting means 5, 6 which deflection ion beams are arranged in the device, then an upper-stage deflecting means is used to deflect an ion beam in any direction while the lower-stage deflecting means is used to deflect the ion beam in its reflective direction so that the ion beam may be radiated to one point (0) on the surface of a sample 2. |
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Bibliography: | Application Number: JP19910142436 |