METHOD AND APPARATUS FOR SINGLE POINT BONDING

PURPOSE:To obtain a stable bonding strength at leads without irregularity even if the widths of the leads are small. CONSTITUTION:A rotating mechanism 12 for relatively moving one or both of a bonding tool 6 and leads 3 to incline a vibrating direction of the tool by an ultrasonic wave at a predeter...

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Bibliographic Details
Main Authors SUEMATSU MUTSUMI, MAEHARA YOICHIRO
Format Patent
LanguageEnglish
Published 24.11.1992
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To obtain a stable bonding strength at leads without irregularity even if the widths of the leads are small. CONSTITUTION:A rotating mechanism 12 for relatively moving one or both of a bonding tool 6 and leads 3 to incline a vibrating direction of the tool by an ultrasonic wave at a predetermined angle with respect to a longitudinal direction of the leads, is provided. The tool is inclined at a predetermined angle with respect to the vibrating direction to form a device opening 21, and a carrier tape 20 in which leads 22 are disposed, is conveyed.
Bibliography:Application Number: JP19910105944