LEAD FRAME FOR SEMICONDUCTOR DEVICE

• Main Author: NUMATA TORU
• Format: Patent
• Language: English
• Published: 23.10.1992
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

PURPOSE:To make the solderability of the tip part of a lead good by a method wherein a stepped part or a recessed part is formed in a part to be used as the tip of an outer lead when the lead is shaped and a section to be used as the tip of the lead is plated. CONSTITUTION:A stepped part 11 or a recessed part 12 is formed in a part to be used as the tip of an outer lead 1 when a lead is shaped; a section to be used as the tip of the lead is plated. For example, a stepped part 11 is formed by deforming an outer lead 1 at the outside by a coining operation so as to be lifted at a part to be used as the tip of the outer lead 1 from the lead expansion length, of a lead frame, from which a desired size is obtained when a lead found in advance by a calculation is shaped. Alternatively a recessed part 12 is formed by a length of about 1mm to its outside by an etching operation or a coining operation. The depth of the stepped part 11 or the recessed part 12 is set to about 2/3 of the thickness of the lead frame and the section of the tip of the lead is plated to be about 2/3 of the thickness of the lead.