MAGNETIC BUBBLE MEMORY DEVICE

PURPOSE:To provide a method for reducing the dispersion of inclination of a chip CHI occurring at the time of transfer mold (REG) in a magnetic bubble memory device. CONSTITUTION:A chip CHI is stuck onto a wiring substrate SUB and then, a cap (CAP) having holes HL1-HL4 is fitted to a central part an...

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Bibliographic Details
Main Authors KATAOKA SHIGEKI, NOZAWA HISAO
Format Patent
LanguageEnglish
Published 01.10.1992
Subjects
INFORMATION STORAGE
PHYSICS
STATIC STORES
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Summary:PURPOSE:To provide a method for reducing the dispersion of inclination of a chip CHI occurring at the time of transfer mold (REG) in a magnetic bubble memory device. CONSTITUTION:A chip CHI is stuck onto a wiring substrate SUB and then, a cap (CAP) having holes HL1-HL4 is fitted to a central part and a peripheral part. A chip coating agent SIL1 with comparatively high hardness is injected from the hole HL1 of the central part and a soft chip coating agent SIL2 is injected from the hole of the peripheral part. Subsequently, transfer molding is performed. The device with good heat cycle resistance, less dispersion of chip inclination angle, high reliability and good memory action characteristic can be obtained.
Bibliography:Application Number: JP19910037146