METHOD FOR MEASURING AMOUNT OF LAPPING IN LAPPING MACHINE

PURPOSE:To provide a method of accurately measuring a polishing amount of a workpiece mounted on a workpiece holding jig, in the case of a lapping machine of type such that the workpiece holding jig, provided in a correcting ring, is mounted on a lapping surface plate to turn together the correcting...

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Bibliographic Details
Main Authors WAKI YOSHIHARU, AOI HIROICHI, TAKESHITA KOJI, NAKAZAWA KOJI, HAGIWARA YOSHIKI, ISONO TATEHIRO
Format Patent
LanguageEnglish
Published 01.09.1992
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:PURPOSE:To provide a method of accurately measuring a polishing amount of a workpiece mounted on a workpiece holding jig, in the case of a lapping machine of type such that the workpiece holding jig, provided in a correcting ring, is mounted on a lapping surface plate to turn together the correcting ring and the workpiece holding jig according to rotating the lapping surface plate. CONSTITUTION:In the case of a lapping machine of type such that a workpiece holding jig 3, provided in a correcting ring 1, is placed on a lapping surface plate to turn together the correcting ring 1 and the workpiece holding jig 3 according to rotating the lapping surface plate 5, a polishing amount of a workpiece is detected by measuring relative displacement between the above- mentioned correcting ring 1 and workpiece holding jig 3.
Bibliography:Application Number: JP19910010590