TAPED ELECTRONIC COMPONENT CONNECTION METHOD AND DEVICE

PURPOSE:To provide a taped electronic component connecting device which is used in an electronic component mounting equipment and enables taped electronic components to be easily connected and effectively utilized even if they are left small in number. CONSTITUTION:A pair of movable cutting edges 26...

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Bibliographic Details
Main Authors MORIOKA MANABU, MUNEZANE TAKASHI, MITSUSHIMA TAKATOSHI, NEGISHI SHIGEFUSHI
Format Patent
LanguageEnglish
Published 25.08.1992
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To provide a taped electronic component connecting device which is used in an electronic component mounting equipment and enables taped electronic components to be easily connected and effectively utilized even if they are left small in number. CONSTITUTION:A pair of movable cutting edges 26 and a fixed cutting 26 which cut the tip of one of two taped electronic components and the end of the other component, a lever 23 which drives the movable cutting edges 26, a position aligning pin 29 which positions the two cut taped electronic components 1, a base 16 which connects the taped electronic component 1, and a shaft 35 which pulls the tip of an adhesive tape 5 that connects the cover tape 8 of the taped electronic component 1 and a tape mount 3 onto the base 16 are provided. A slidable cutter 11 is provided to cut off the transfer holes 14 of the taped electronic component 1 connected by the adhesive tape 5 and to separate the adhesive tape 5 of the cover tape 8 from the adhesive tape 5 of the taping mount 13 by cutting.
Bibliography:Application Number: JP19910005686