MULTICHIP SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

PURPOSE:To enable semiconductor elements to be enhanced in mounting density by a method wherein semiconductor elements are mounted on a flexible printed board, and the board is bent to enable the semiconductor elements to overlap each other. CONSTITUTION:Semiconductor elements 2 are mounted on a fle...

Full description

Saved in:
Bibliographic Details
Main Authors HIROTA KAZUO, ARAKAWA KATSUHIRO
Format Patent
LanguageEnglish
Published 16.07.1992
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PURPOSE:To enable semiconductor elements to be enhanced in mounting density by a method wherein semiconductor elements are mounted on a flexible printed board, and the board is bent to enable the semiconductor elements to overlap each other. CONSTITUTION:Semiconductor elements 2 are mounted on a flexible printed board 1 provided with a wiring and input-output terminals 3 are provided to the board 1, and then the board 1 is bent over. In this manufacturing method, the semiconductor elements 2 are connected to the flexible printed board 1 previously provided with a wiring and the input-output terminals 3, and a coating is provided onto the elements 2 and the element joints for the protection of the elements. By this setup, a multichip semiconductor device can be enhanced in mounting density without enlarging a module in size.
Bibliography:Application Number: JP19900322769