MANUFACTURE OF POLYIMIDE RESIN FILM PATTERN

• Main Authors: SEKINE HIROYOSHI, KOJIMA MITSUMASA, SATO NINTEI
• Format: Patent
• Language: English
• Published: 16.07.1992
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To improve the configuration of the edge part of a pattern by a method wherein, after the pattern has been exposed through the intermediary of a photomask having the processing dimensions equal to the shape of the pattern; exposing, developing and etching processes are repeated in order of size, starting from the smallest size, of photomask processing dimensions which are larger than the processing dimensions of the photomask. CONSTITUTION:After an exposing operation has been conducted through a photomask 6, the developing operation of positive resist layer 5 and the etching treatment of polyimide resin film 4 are conducted simultaneously, a pattern 7 is formed on the prescribed part, and an Al bonding pad part 10 is exposed. Besides, the edge part of the pattern 7 of a polyimide resin film 4 is etched through the intermediary of a photomask 8 having the processing dimensions larger than the photomask 6, and a pattern 9 is formed. Subsequently, the positive resist layer 5 is removed using the exfoliating solution such as an organic solvent and the like in such a manner that the polyimide resin film 4 is not dissolved and that the damage such as cracks and the like are not generated on the film 4. As a result, the shape of the pattern edge part can be formed excellently.