SOLDER REFLOW FURNACE

PURPOSE:To reduce an area of installation of a reflow furnace and to constrain the consumption of gas for preventing oxidation of solder by providing an elevating means for a base plate in a chamber provided with carry-in and carry- away ports on the base plate and shutters for opening/closing the c...

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Bibliographic Details
Main Authors TAKAHASHI TETSUO, MOGI KUNIO, KUDO KOJI
Format Patent
LanguageEnglish
Published 29.06.1992
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CONVEYING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING THIN OR FILAMENTARY MATERIAL
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PACKING
PERFORMING OPERATIONS
PNEUMATIC TUBE CONVEYORS
PRINTED CIRCUITS
SHOP CONVEYOR SYSTEMS
SOLDERING OR UNSOLDERING
STORING
TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PURPOSE:To reduce an area of installation of a reflow furnace and to constrain the consumption of gas for preventing oxidation of solder by providing an elevating means for a base plate in a chamber provided with carry-in and carry- away ports on the base plate and shutters for opening/closing the carry-in and carry-away ports. CONSTITUTION:Since the elevating means 8A, 8B for transferring the base plate 10 in the vertical direction are built in the chamber 1, a floor area of installation can be reduced remarkably. The shutters 6, 7 are provided on the carry-in and carry out ports 4, 5 to prevent wasteful discharge of gas for preventing oxidation of solder from the chamber 1, to constrain the consumption of gas for preventing oxidation of solder and as a result to reduce the running cost.
Bibliography:Application Number: JP19900307517