MANUFACTURE OF WIRING BOARD

PURPOSE:To enable the disused part of palladium to be almost fully removed at a low cost without dissolving copper by a method wherein a board is dipped into a potassium permanganate solution and then subjected to the combined specific treatments to remove palladium used as plating catalyst from the...

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Bibliographic Details
Main Authors NAKASO AKISHI, HATAKEYAMA SHUICHI, KIDA AKINARI, URASAKI NAOYUKI
Format Patent
LanguageEnglish
Published 25.06.1992
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To enable the disused part of palladium to be almost fully removed at a low cost without dissolving copper by a method wherein a board is dipped into a potassium permanganate solution and then subjected to the combined specific treatments to remove palladium used as plating catalyst from the surface of the board. CONSTITUTION:Palladium serving as plating catalyst is attached to the surface of a resin board 3, then a plating resist 6 is formed on a part of the board 3 where a circuit is not provided, a plating copper 7 is formed on a part of the board 3 which serves as a circuit through a chemical plating method, in succession the plating resist 6 is separated off, and then the disused palladium residual on the surface of the board 3 is removed. When palladium is removed, first of all a board is dipped onto a potassium permanganate solution. Then, the board is subjected to an ultrasonic rinsing process and then dipped into a hydroxyammonium sulfate solution. By this setup, palladium present at the rugged resin oxide layer are almost completely removed from the surface of the board.
Bibliography:Application Number: JP19900302602