MANUFACTURE OF PRINTED WIRING BOARD

PURPOSE:To obtain a printed wiring board whose external shape can be worked without crazes or cracks to reduce the fraction defective by providing regulating holes outside a profile forming position having a relatively high shearing stress. CONSTITUTION:Holes 2 are first opened at an insulating boar...

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Bibliographic Details
Main Authors INAMI TOSHIYUKI, TAKEMURA TOMOYUKI
Format Patent
LanguageEnglish
Published 09.06.1992
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To obtain a printed wiring board whose external shape can be worked without crazes or cracks to reduce the fraction defective by providing regulating holes outside a profile forming position having a relatively high shearing stress. CONSTITUTION:Holes 2 are first opened at an insulating board 1 by a drill. Then, printed wirings 3 and through hole plating 4 are formed by electroless plating. A regulating hole 6 having a relatively large diameter is formed outside a profile forming position 5 near a part having less holes 2 by drilling. After the holes 6 are formed, the position 5 is punched by a die to provide a long hole 7 and a sewing seam 8. The holes 6 are formed at the board 1 to be formed with a profile without craze, and the holes 7, the seam 8 can be provided.
Bibliography:Application Number: JP19900291360