SEMICONDUCTOR INTEGRATED CIRCUIT

PURPOSE:To easily judge the conditions of bonding of a chip to a package and automatize switch-over of connection of an inner circuit by installing a detector to inspect whether or not pads are electrically connected to the outside. CONSTITUTION:A detector 42 inspects whether or not input pads 401,...

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Bibliographic Details
Main Author TAKASE RIKIO
Format Patent
LanguageEnglish
Published 09.06.1992
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To easily judge the conditions of bonding of a chip to a package and automatize switch-over of connection of an inner circuit by installing a detector to inspect whether or not pads are electrically connected to the outside. CONSTITUTION:A detector 42 inspects whether or not input pads 401, 402,... and output pads 411, 412,... are electrically connected to the outside. When the detector 42 connected to the pads to be connected to the outside detects that the pads are not connected to the outside for example because of wire breakage, the operation of an inner circuit 43 is stopped. Therefore, troubles in using are prevented. When one chip is mounted on packages of different sorts for example because chip pads are more than package pins, the detector 42 detects pads not bonded to the package pins and connection of the circuit 43 is automatically changed to the predetermined conditions according to the mounted packages. Thereby manufacture is facilitated compared with a conventional circuit.
Bibliography:Application Number: JP19900291094