THERMOSETTING RESIN AND ITS PRODUCTION

• Main Authors: TAKAYANAGI HIROSHI, YAMAGUCHI TERUHIRO, ICHIKAWA FUMIAKI, KAWABATA TOSHIHIKO
• Format: Patent
• Language: English
• Published: 04.06.1992
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PURPOSE:To obtain the subject resin having excellent heat-resistance, flow stability and hardenability and useful as varnish, etc., by heating an organic compound having carbodiimide bond in the molecule and an organic compound having multiple bond in the molecule. CONSTITUTION:The objective resin can be produced by properly heating (A) an organic compound containing one or more carbodiimide bonds in the molecule and producible from an organic polyisocyanate such as phenylene-1,3-diisocyanate in the presence of a catalyst for promoting the carbodiimidation of isocyanate and (B) an organic compound containing one or more multiple bonds in the molecule, e.g. a compound having cyanate group and expressed by formula (R1 is aromatic polyvalent organic group; the cyanic acid ester group is directly bonded to the aromatic rind of R1; n is integer of >=2) in the presence of (C) one or more kinds of crosslinking-promoting catalyst such as tertiary amine.