HIGH-PRECISE METHOD FOR CUTTING RIGID BRITTLE MATERIAL

PURPOSE:To reduce occurrence of chippings and to improve cut surface precision by applying a multistage cutting work on the lower part of a work at a speed lower than a speed during a work to cut the upper part thereof. CONSTITUTION:When ceramics 2 being a rigid brittle material is cut by using a di...

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Bibliographic Details
Main Authors YAMASAKA MINORU, TAKESHITA KOJI
Format Patent
LanguageEnglish
Published 02.06.1992
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:PURPOSE:To reduce occurrence of chippings and to improve cut surface precision by applying a multistage cutting work on the lower part of a work at a speed lower than a speed during a work to cut the upper part thereof. CONSTITUTION:When ceramics 2 being a rigid brittle material is cut by using a diamond grinding stone 1, a cutting work is effected through a multistage cutting work and from the position, located down by a distance of hundreds mum, of a lower part at a speed lower than the feed speed of an upper part. This method reduces an amount of produced chippings to approximate 10mum or less and also reduces straightness of a cut surface to approximate 3mum/60mm. A machining amount at after-processing, such as a finish work after cutting, can be reduced from about 100-200mum to approximate 10mum.
Bibliography:Application Number: JP19900278980