METHOD OF CALCULATING NUMBER OF SEMICONDUCTOR CHIPS

• Main Author: OTSUKA HISAO
• Format: Patent
• Language: English
• Published: 26.05.1992
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PURPOSE:To enable the total number of semiconductor chips obtained from a wafer to be theoretically and accurately calculated by a method wherein it is assumed that a rectangular coordinate system is provided to the wafer making the center of a chip forming region serve as an origin, and the chip fo...