METHOD OF CALCULATING NUMBER OF SEMICONDUCTOR CHIPS

• Main Author: OTSUKA HISAO
• Format: Patent
• Language: English
• Published: 26.05.1992
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PURPOSE:To enable the total number of semiconductor chips obtained from a wafer to be theoretically and accurately calculated by a method wherein it is assumed that a rectangular coordinate system is provided to the wafer making the center of a chip forming region serve as an origin, and the chip forming region is divided, with the required size of the semiconductor chip as a reference, on the rectangular coordinate system, whereby the total number of the chips can be obtained. CONSTITUTION:An inner part 4 inside a chip non-forming region 3 provided to all the periphery of a wafer is made to serve as an effective region used for the formation of semiconductor chips. It is assumed that a rectangular coordinates system is provided to the effective region 4 making the center of the wafer serve as an origin O, and an X axis is provided so as to be parallel with the lenghwise direction of an orientation flatness 2. As the radius R of the wafer is previously determined, the effective radius r of the effective region 4 or the distance L between the origin O and the chip non-forming region 3 on an orientation flatness 2 side along a negative Y axis is calculated. Using these values, the effective region 4 is divided on the basis of the required size of a chip along the rectangular coordinate system, whereby the total number of chips 5 obtained from the wafer can be calculated.