COOLING CONTAINER FOR SUPPORTING SUPERCONDUCTING MATERIAL

• Main Author: YOKOTA MASANOBU
• Format: Patent
• Language: English
• Published: 15.05.1992
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CABLES; COLD ROOMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; CONDUCTORS; COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS; ELECTRICITY; HEAT PUMP SYSTEMS; HEATING; ICE-BOXES; INDUCTANCES; INSULATORS; LIGHTING; LIQUEFACTION SOLIDIFICATION OF GASES; MAGNETS; MANUFACTURE OR STORAGE OF ICE; MECHANICAL ENGINEERING; REFRIGERATION OR COOLING; REFRIGERATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; TRANSFORMERS; WEAPONS

PURPOSE:To increase the degree of freedom in installing direction of the title container and reduce the usage of a refrigerant by thermally connecting part of thermal earth plates to a substrate and fixing the other part of the thermal earth plates to the contacts between the side faces adjacent to the bottom of the container and between the side faces adjacent to the ceiling of the container by bringing the other part into contact with the contacts and adjusting the amount of the refrigerant so that the other part of the earth plates can be dipped in the refrigerant. CONSTITUTION:This cooling container for supporting superconductor is provided with thermal earth plates 16 as a fixing means of a substrate 14 and part of the plate 16 are connected with the substrate 14. The other part of the plate 16 are fixed, at least, to the contacts between the side faces adjacent to the bottom of the container and between the side faces adjacent to the ceiling of the container by bringing the other part into contact with the contacts. Then the amount of a refrigerant 20 is adjusted so that at least the other part of the plates 16 can be dipped in the refrigerant 20. Therefore, the degree of freedom can be increased in the installing method of the container and the usage of the refrigerant can be reduced, since a superconductor placed on and supported by the substrate 14 can be always cooled irrespective of the installing method of this container 12.