SEMICONDUCTOR DEVICE

PURPOSE:To prevent short-circuit due to solder, by equipping a semiconductor device with a protruding part which surrounds a metal heat sink, and exposing it from resin, only at the tip of the protruding part. CONSTITUTION:A resin chip carrier 80 has a structure wherein four surfaces of the side sur...

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Bibliographic Details
Main Authors ITO MAMORU, ENOMOTO USUKE, SAKAMOTO TOMOO
Format Patent
LanguageEnglish
Published 12.05.1992
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To prevent short-circuit due to solder, by equipping a semiconductor device with a protruding part which surrounds a metal heat sink, and exposing it from resin, only at the tip of the protruding part. CONSTITUTION:A resin chip carrier 80 has a structure wherein four surfaces of the side surface part of a heat sink 85 protruding from a mold resin main body are covered with mold resin 94A, and solder 3 is prevented from being sucked up. Said mold resin 94A is formed up to the same surface as the bottom surface of the heat sink 85, or a surface a little higher than the bottom surface. That is, the heat sink 85 is covered so as to be seen a little when viewed from the horizontal direction. Thereby short-circuit due to excessive suction of solder (paste solder) 3 of the side surface part of the heat sink 85 can be reduced.
Bibliography:Application Number: JP19900259575