THERMOPLASTIC RESIN COMPOSITION

PURPOSE:To obtain the subject composition having excellent moldability, solvent resistance, heat-resistance, mechanical strength, etc., and suitable as a material for automobile and electrical and electronic fields by compounding a specific unsaturated copolymer with a phenylene ether resin. CONSTIT...

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Bibliographic Details
Main Authors OMURA HARUO, NAKANO HIROSHI, ARITOMI MITSUTOSHI, KIHIRA MICHIHARU
Format Patent
LanguageEnglish
Published 27.04.1992
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PURPOSE:To obtain the subject composition having excellent moldability, solvent resistance, heat-resistance, mechanical strength, etc., and suitable as a material for automobile and electrical and electronic fields by compounding a specific unsaturated copolymer with a phenylene ether resin. CONSTITUTION:The objective composition can be produced by compounding and kneading (A) 10-90wt.% of a modified unsaturated copolymer produced by reacting (i) a 2-12C alpha-olefin (e.g. ethylene) with (ii) 0.05-50mol% (in the copolymer) of a non-conjugated chain diene expressed by formula (R to R are H or <=8C alkyl; n is 1-10) and reacting the resultant unsaturated copolymer with (iii) preferably 0.01-30wt.% (based on the modified copolymer) of a compound having hydroxyl group and ethylenic double bond (e.g. 2-hydroxyethyl acrylate) and (B) 90-10wt.% of a hydroxyalkylated phenylene ether resin.
Bibliography:Application Number: JP19900268289