LEAD FRAME AND SEMICONDUCTOR MANUFACTURING DEVICE

PURPOSE:To realize the management of lead frames in the unit of a lead frame by a method wherein individually different lead frame IDs are respectively provided on the part other than the part, which is used as a product, of each lead frame. CONSTITUTION:Information on lead frames and the like are p...

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Bibliographic Details
Main Authors SHIMOYAMA AKIO, IWASAKI NORITATSU
Format Patent
LanguageEnglish
Published 03.04.1992
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To realize the management of lead frames in the unit of a lead frame by a method wherein individually different lead frame IDs are respectively provided on the part other than the part, which is used as a product, of each lead frame. CONSTITUTION:Information on lead frames and the like are previously ready- inputted in an information processing part 260. A supply magazine 310, in which a plurality of sheets of the lead frames 100 are housed, is set on a supply part 210. Lead frame IDs 110 are read by a pretreatment lead frame ID read part 240 and the read IDs are collated to the above information on the lead frames. When the result of the collation is correct, a semiconductor manufacture treatment is performed on the lead frames at a manufacture treatment part. After this, the treated lead frames are housed in a housing magazine at a housing part 230 and treatment information on the semiconductor manufacture treatment is added to the above information on the lead frames.
Bibliography:Application Number: JP19900221687