COPPER ALLOY FOR BACKING PLATE
PURPOSE:To obtain the copper alloy suitable for a backing plate for fixing a target used for sputtering by incorporating Cu with specified amounts of Fe and P or other specified metallic elements as well. CONSTITUTION:As a backing plate material fixing a target used for forming a high function thin...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
27.03.1991
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PURPOSE:To obtain the copper alloy suitable for a backing plate for fixing a target used for sputtering by incorporating Cu with specified amounts of Fe and P or other specified metallic elements as well. CONSTITUTION:As a backing plate material fixing a target used for forming a high function thin film by sputtering, a Cu alloy contg., by weight, 0.1 to 2.6% Fe and 0.001 to 0.1% P, or furthermore contg. one or more kinds among 0.01 to 1.0% Zn, 0.01 to 2.5% Sn, 0.001 to 0.5% Mg, 0.01 to 1.0% Co, 0.01 to 1.0% Ni, 0.01 to 1.0% Te and 0.01 to 4.0% Pb and the balance Cu is used. The copper alloy for a backing plate free from thermal deformation in the use and furthermore having excellent brazing and soldering properties for a target can be obtd. |
---|---|
Bibliography: | Application Number: JP19890209381 |