COPPER ALLOY FOR BACKING PLATE

• Main Authors: SHIMIZU JUICHI, FUKUDA KENJI, KUWANO AKIRA
• Format: Patent
• Language: English
• Published: 27.03.1991
• Subjects: ALLOYS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; FERROUS OR NON-FERROUS ALLOYS; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TREATMENT OF ALLOYS OR NON-FERROUS METALS

PURPOSE:To obtain the copper alloy suitable for a backing plate for fixing a target used for sputtering by incorporating Cu with specified amounts of Fe and P or other specified metallic elements as well. CONSTITUTION:As a backing plate material fixing a target used for forming a high function thin film by sputtering, a Cu alloy contg., by weight, 0.1 to 2.6% Fe and 0.001 to 0.1% P, or furthermore contg. one or more kinds among 0.01 to 1.0% Zn, 0.01 to 2.5% Sn, 0.001 to 0.5% Mg, 0.01 to 1.0% Co, 0.01 to 1.0% Ni, 0.01 to 1.0% Te and 0.01 to 4.0% Pb and the balance Cu is used. The copper alloy for a backing plate free from thermal deformation in the use and furthermore having excellent brazing and soldering properties for a target can be obtd.