MANUFACTURE OF CONDUCTING COMPOSITION MATERIAL AND CONDUCTING CIRCUIT

• Main Authors: EBISAWA KATSUO, ASAI TADAMICHI, OGIWARA SATORU, ITO OSAMU, OTANI MICHIO, ISOMAE HIROMI, KAMIMURA NORITAKA, OGAWA TOSHIO, KOBAYASHI TAKAO
• Format: Patent
• Language: English
• Published: 22.03.1991
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CONDUCTORS; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; INSULATORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS THEREFOR; WOODSTAINS

PURPOSE:To prevent the occurrence of worm-eaten hole-shaped defects and form a dense and uniform thin conducting layer by containing a material generating a specific quantity or more of dimethylsiloxane at the time of baking in a composition material containing metal powder, a binder and an organic...