MANUFACTURE OF CONDUCTING COMPOSITION MATERIAL AND CONDUCTING CIRCUIT

PURPOSE:To prevent the occurrence of worm-eaten hole-shaped defects and form a dense and uniform thin conducting layer by containing a material generating a specific quantity or more of dimethylsiloxane at the time of baking in a composition material containing metal powder, a binder and an organic...

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Main Authors EBISAWA KATSUO, ASAI TADAMICHI, OGIWARA SATORU, ITO OSAMU, OTANI MICHIO, ISOMAE HIROMI, KAMIMURA NORITAKA, OGAWA TOSHIO, KOBAYASHI TAKAO
Format Patent
LanguageEnglish
Published 22.03.1991
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Summary:PURPOSE:To prevent the occurrence of worm-eaten hole-shaped defects and form a dense and uniform thin conducting layer by containing a material generating a specific quantity or more of dimethylsiloxane at the time of baking in a composition material containing metal powder, a binder and an organic solvent. CONSTITUTION:Glass powder 5 pts.wt. is added to spherical copper powder 100 pts.wt. to obtain a powder composition material. A vehicle such as acrylic resin and silicone resin 0.1-1.0 pts.wt. are added to it and kneaded, and butyl carbitol acetate is added to obtain the conductor paste with the viscosity suitable for screen printing. It is coated on an alumina board and baked in the nitrogen atmosphere at 900 deg.C for 10min. Dimethylsiloxane 100ppm or above is generated in the baking atmosphere, thus adequate coagulation among metal grains is suppressed, no worm-eaten hole-shaped defect is generated on a conducting layer with the thickness 5mum or below, and the dense and uniform layer can be formed.
Bibliography:Application Number: JP19890204320