INTEGRATED CIRCUIT

PURPOSE:To prevent the damage of a conductor pattern even if the particles scatter at the time of trimming by protecting the conductor pattern with a protective film doubly. CONSTITUTION:On a ceramic substrate 1, a conductor layer 16a is printed and is baked. In the spaces among the patterns composi...

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Bibliographic Details
Main Author SUMI TOMOAKI
Format Patent
LanguageEnglish
Published 26.02.1991
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
RESISTORS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To prevent the damage of a conductor pattern even if the particles scatter at the time of trimming by protecting the conductor pattern with a protective film doubly. CONSTITUTION:On a ceramic substrate 1, a conductor layer 16a is printed and is baked. In the spaces among the patterns composing said conductor layer 16a, namely on the substrate 1, a film resistor is formed by baking. Next, a protective film 17a is laminated on the conductor layer 16a in its thickness direction. for the film-form resistor and the protective film 17a, the same material is used and the protective film 17a for protecting the conductor layer 16a from the particles at the time of trimming and the part for insulating plural conductor patterns which crossing one another are formed at the same time. A protective film 18 is further formed over the protective film 17a in order to protect the conductor film 16a doubly, so that the damage of the conductor film 16a can be prevented even if the particles scatter at the time of trimming.
Bibliography:Application Number: JP19890179849