PRINTED CIRCUIT BOARD

PURPOSE:To decrease solder bridges by a method wherein a recess is provided to one of the opposed solder lands to decrease it in planar area inside the recess. CONSTITUTION:A required circuit pattern is printed on a board 11, a rectangular solder land 13 is provided to each end of the circuit patter...

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Bibliographic Details
Main Authors YOKOMIZO YUJI, KAWABE TAKURO, EZAKI SHIRO
Format Patent
LanguageEnglish
Published 21.02.1991
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To decrease solder bridges by a method wherein a recess is provided to one of the opposed solder lands to decrease it in planar area inside the recess. CONSTITUTION:A required circuit pattern is printed on a board 11, a rectangular solder land 13 is provided to each end of the circuit pattern through the intermediary of a long belt-like lead-out section 12, and the electrode of a chip component 14 of an electronic circuit component is fixed to the solder land 13 through a solder 15. An arc-shaped recess 16a recessed inward is provided to the opposed side of a solder land 13a of the opposed solder lands provided adjacent to each other, and a protrusion 17a corresponding to the recess 16a is provided to the opposed side of the other solder land 13b of the opposed solder lands. Therefore, the solder land 13a is reduced in plane area inside the recess 16a, and a comparatively large area section is formed on both sides which sandwich the recess 16a between them respectively.
Bibliography:Application Number: JP19880244534