WIRING CORRECTION APPARATUS

• Main Author: EGUCHI KOHEI
• Format: Patent
• Language: English
• Published: 19.02.1991
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PURPOSE:To execute a cutting operation of an Al wiring, an opening operation of a protective film on the Al wiring and a drawing operation of a W wiring by using a focused laser beam by a method wherein a focused laser beam mechanism and a focused ion beam mechanism are assembled in one apparatus. CONSTITUTION:A focused laser beam optical system 1 and a focused ion beam optical system 8 are installed on an identical chamber 21. The focused ion beam optical system 8 and the chamber 21 are not separated spatially so that ions extracted from the focused ion beam optical system 8 can reach a specimen 5; a vacuum can be evacuated uniformly. In addition, the focused ion beam optical system and the chamber are separated by a transparent window. A specimen stage 4 on which the specimen 5 is placed is installed inside the chamber 21; the specimen stage 4 can be moved between a part directly under the focused laser beam optical system 1 and a part directly under the focused ion beam optical system 8. Thereby, a cutting operation of an Al wiring an opening operation of a protective film on the Al wiring and a drawing operation of a W wiring can be executed in a good shape, at a high success rate and in a short time.