SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

PURPOSE:To prevent the bonding of the exposed region of an insulating layer and H2O from occurring, and improve the sticking of a wiring, by forming an aperture part having a side wall protecting film by the RIE method. CONSTITUTION:A contact hole is formed at a part of a first insulating layer 22....

Full description

Saved in:
Bibliographic Details
Main Author AKAISHI YOSHIO
Format Patent
LanguageEnglish
Published 11.12.1991
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

Be the first to leave a comment!
You must be logged in first