PREPARATION OF POLYAMIDE RESIN COMPOSITION

PURPOSE:To prepare the subject composition having improved toughness, impact resistance, high temperature rigidity, etc., and low water absorbing constant by mixing a low mol.wt. poly amide with a polar group-containing polyolefin under a specific condition. CONSTITUTION:(A) A poly amide low polycon...

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Bibliographic Details
Main Authors TAKADA TOSHIMASA, ISHIMARU ETSUJI, ABE YOSHIHARU
Format Patent
LanguageEnglish
Published 06.12.1991
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PURPOSE:To prepare the subject composition having improved toughness, impact resistance, high temperature rigidity, etc., and low water absorbing constant by mixing a low mol.wt. poly amide with a polar group-containing polyolefin under a specific condition. CONSTITUTION:(A) A poly amide low polycondensate or low polymeric compound having an intrinsic viscosity of 0.01-0.5dl/g and containing lactam component units and/or aliphatic amino carboxylic acid component units is mixed with (B) a polar group-containing poly olefin prepared by grafting 0.01-10 pts.wt. of a polar group-containing unsaturated compound to 100 pts.wt. of a poly olefin in a ratio of 5:95-98:2, preferably 20:80-95:5, in a melting state with imparting a shear stress, thereby providing a poly amide low poly condensate (salt) composition.
Bibliography:Application Number: JP19900075917