THERMOSETTING RESIN COMPOSITION

PURPOSE:To obtain the title composition useful for sealing, having excellent compatibility with various epoxy resins, comprising a silicon-containing epoxy compound having a specific structural unit and a compound capable of starting ring opening polymerization of epoxy group. CONSTITUTION:The objec...

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Bibliographic Details
Main Authors MIYAGAWA HIROYUKI, HIROSE SHOICHI, OURA AKIO
Format Patent
LanguageEnglish
Published 06.12.1991
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PURPOSE:To obtain the title composition useful for sealing, having excellent compatibility with various epoxy resins, comprising a silicon-containing epoxy compound having a specific structural unit and a compound capable of starting ring opening polymerization of epoxy group. CONSTITUTION:The objective composition comprising (A) an organosilicon compound shown by the formula (n is 2 or 3; R is substituent group and 1-20C alkyl, alkoxy or substituted alkyl; m is 0-4) containing three or more structural units directly bonded Si in one molecule and (B) a compound containing two or more functional groups, which can be subjected to addition reaction with epoxy group, in one molecule and/or a compound (e.g. 2-methylimidazole) capable of starting ring opening polymerization of epoxy ring as essential components.
Bibliography:Application Number: JP19900077636