PRODUCTION OF MODIFIED EPOXY COMPOSITION

PURPOSE:To obtain the subject composition, excellent in bonding strength, etc., and suitable as semiconductor sealing media by coagulating a partially crosslinked rubber-like random copolymer latex, regulating the residual volatile content to a specific value, then adding and dispersing the regulate...

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Main Authors SATO HOZUMI, MATSUNAGA TATSUAKI, MIYAMURA TOSHIO, IWANAGA SHINICHIRO
Format Patent
LanguageEnglish
Published 05.02.1991
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Summary:PURPOSE:To obtain the subject composition, excellent in bonding strength, etc., and suitable as semiconductor sealing media by coagulating a partially crosslinked rubber-like random copolymer latex, regulating the residual volatile content to a specific value, then adding and dispersing the regulated latex in an epoxy group-containing compound and removing the residual volatile substances. CONSTITUTION:A coagulant is added, etc., to coagulate a latex of a partially crosslinked rubber-like random copolymer (e.g. prepared by copolymerizing divinylbenzene, etc., with butadiene, etc., and/or acrylic acid, etc.) and the residual volatile content is regulated to 5-60wt.% by centrifugal dehydration, etc. The resultant coagulated copolymer is then added and dispersed in an epoxy group-containing compound and the residual volatile substances are removed (preferably to <=0.1wt.%) by vacuum drying, etc., to efficiently produce the objective composition containing rubber-like particles homogeneously dispersed in the form of particles in the epoxy compound.
Bibliography:Application Number: JP19890161837