SOLDERING METHOD OF ELECTRONIC COMPONENT

PURPOSE:To enable a soldering operation of high quality to be easily and efficiently carried out by a method wherein liquid possessed of a hot-reducing property such as flux or the like is partly applied to the pins of an electronic component provided with active metal, and the pins are heated. CONS...

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Bibliographic Details
Main Author YAMANAKA KOICHI
Format Patent
LanguageEnglish
Published 21.11.1991
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To enable a soldering operation of high quality to be easily and efficiently carried out by a method wherein liquid possessed of a hot-reducing property such as flux or the like is partly applied to the pins of an electronic component provided with active metal, and the pins are heated. CONSTITUTION:Pins 2 subjected to an oxidizing.reducing active surface treatment such as copper plating are provided to an electronic component 1. Pads 3 are provided corresponding to the pins 2, and cream solders 5 are supplied onto the pads 3 through printing or the like. Then, hot-reducing liquid 6 represented by flux is applied to the soldering tips of the pins 2 of the electronic component 1, which is made to stand as heated. By this setup, the reducing liquid applied parts of the pins 2 are turned into pure metal surfaces and improved in solder wettability. The pins 2 excluding their tips are surface-oxidized and deteriorated in solderability. By this setup, when a soldering operation is executed, cream solder 5 previously fed is fused by heating to form an excellent fillet on the soldered part of the pin 2, so that the pin 2 can be soldered high in reliability.
Bibliography:Application Number: JP19900061382