MANUFACTURE OF WIRING BOARD

• Main Authors: NAKASO AKISHI, MINAGAWA KAZUYASU, HATAKEYAMA SHUICHI, KIDA AKINARI, URASAKI NAOYUKI
• Format: Patent
• Language: English
• Published: 13.11.1991
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PURPOSE:To attain the advancement into high density and also improve the reliability in connection by arranging a metallic foil so that the nickel may contact with an insulating material, and making them into a laminate, and covering the exposed copper surface with nickel after implementing required circuit processing. CONSTITUTION:A metallic foil 1, where nickel 2 is formed at the surface, is arranged so that the nickel 2 may contact with an insulating material 3 so as to constitute a laminate, and required circuit processing is applied and those are wired, and then exposed copper surface is covered with nickel 5. Accordingly, since wiring conductor of a wiring board consist of a copper layer and nickel layers 2 and 5 wrapping the copper layer 1, the generation of dendrite from not only between copper and an insulating board 3 but also the side and the top of a copper pattern can be suppressed. Hereby, the deterioration of the insulation resistance between wirings is prevented, and the interval between wirings can be reduced, and also the insulating properties of through hole wiring improves, and the advancement into high density can be realized, and besides the wiring pattern becomes hard to break, and the reliability in connection can be improved.