EPOXY RESIN COMPOSITION

• Main Authors: HARADA TAIRA, KANEKO ISAO
• Format: Patent
• Language: English
• Published: 23.10.1991
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PURPOSE:To obtain the title composition providing a cured material having excellent heat resistance without using a large amount of curing promoter by reacting an epoxy resin mixture containing a novolak epoxy and a bisphenol type epoxy resin with a bisphenol. CONSTITUTION:An epoxy resin mixture (preferably one obtained by reacting a phenol comprising a monohydric phenol and a hydroquinone with an aldehyde in the presence of an acid catalyst to give a novolak and reacting the novolak with a bisphenol and epichlorohydrin) containing a novolak epoxy (one obtained by reacting a novolak with epichlorohydrin) and a bisphenol type epoxy resin (one prepared by reacting a bisphenol with epichlorohydrin) is reacted with a bisphenol A to give the objective composition.