MOUNTING SYSTEM FOR ELECTRONIC COMPONENT

PURPOSE:To achieve a high speed in positioning by projecting light on the positioning pads of a printed board by way of through holes of an electronic component holding means, judging the position deviation based on images picked up with a camera, and moving and adjusting the holding means or the pr...

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Bibliographic Details
Main Author YAMAUCHI KATSUTOSHI
Format Patent
LanguageEnglish
Published 08.10.1991
Subjects
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Summary:PURPOSE:To achieve a high speed in positioning by projecting light on the positioning pads of a printed board by way of through holes of an electronic component holding means, judging the position deviation based on images picked up with a camera, and moving and adjusting the holding means or the printed board in response to the deviation. CONSTITUTION:Two through holes 9 are provided in an electronic component 1. Light is projected on a printed board 2 from a light source 3b by way of the through holes 9. Then, the light is applied on a positioning pad 8 formed on the printed board 2. The images of the part on which the light is applied and the positioning pad 8 are picked up with a camera 3a. In a processing means 12, whether the position deviation occurs or not is judged based on the picked up images. Either of a holding means 4 or the printed board 2 wherein the position deviation occurs is finely adjusted. Thus the accurate positioning is performed. In this way, the positioning can be performed at a high speed.
Bibliography:Application Number: JP19900020503