MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURE THEREOF

PURPOSE:To shorten time for performing a cutting step by previously forming a groove for dividing a metal foil on the foil having a through hole forming region of a board where a through hole in to be formed. CONSTITUTION:A plurality of copper-plated boards 10 are coated with photosen sitive resist...

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Bibliographic Details
Main Authors TAIKO YOICHI, OKI NOBUAKI, WAJIMA MOTOYO
Format Patent
LanguageEnglish
Published 12.09.1991
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To shorten time for performing a cutting step by previously forming a groove for dividing a metal foil on the foil having a through hole forming region of a board where a through hole in to be formed. CONSTITUTION:A plurality of copper-plated boards 10 are coated with photosen sitive resist 15. The resist 15 is exposed by using a dividing pattern 17 and a mask 16. After the resist 15 is developed, it is etched to remove an unneces sary part by dissolving, and the resist 15 is peeled. A plurality of the boards 10 formed with a dividing groove 20 and a wiring pattern 30 are laminated through prepregs 18, 18,... and thermally press-bonded. Through hole forming regions 13 of the laminated boards 10, 10,... are opened by a drill. Through holes 19 are formed at the laminated boards 10, 10,... The holes 19 are plated, and a multilayer printed circuit board is completed.
Bibliography:Application Number: JP19890249993